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  pic12c508a/509a ? 2000 microchip technology inc. ds80024b-page 1 the pic12c5xx-parts conform functionally to the pic12c5xx data sheet (ds40139e), except for the anomalies described below: none clarifications/corrections to the data sheet: in the device data sheet (ds40139e), the following clar- ifications and corrections should be noted. section 13: corrections for the dc characteristics, sec- tion 13.2, section 13.3 and section 13.4 are shown. corrections for the gpio pull-up resistor ranges are shown in table 13-1. for the section titled ?reset?, additional information is provided on osc1/clkin and osc2/clkout pin states during a mclr . errata sheet for pic12c508a/509a (rev. a silicon)
pic12c508a/509a ds80024b-page 2 ? 2000 microchip technology inc. 13.2 dc characteristics: pic12lc508a/509a (commercial, industrial) pic12lce518/519 (commercial, industrial) pic12lcr509a (commercial, industrial) dc characteristics power supply pins standard operating conditions (unless otherwise specified) operating temperature 0 c t a +70 c (commercial) ? 40 c t a +85 c (industrial) parm no. characteristic sym min typ (1) max units conditions ? i wdt ? 2.0 2.0 4 5 a a v dd = 2.5v, commercial v dd = 2.5v, industrial * these parameters are characterized but not tested. note 1: data in the typical ( ? typ ? ) column is based on characterization results at 25 c. this data is for design guidance only and is not tested. 2: this is the limit to which v dd can be lowered in sleep mode without losing ram data. 3: the supply current is mainly a function of the operating voltage and frequency. other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) the test conditions for all i dd measurements in active operation mode are: osc1 = external square wave, from rail-to-rail; all i/o pins tristated, pulled to vss, t0cki = v dd , mclr = v dd ; wdt enabled/disabled as specified. b) for standby current measurements, the conditions are the same, except that the device is in sleep mode. 4: does not include current through rext. the current through the resistor can be estimated by the formula: i r = v dd /2rext (ma) with rext in kohm. 5: the power down current in sleep mode does not depend on the oscillator type. power down current is measured with the part in sleep mode, with all i/o pins in hi-impedance state and tied to v dd or v ss .
? 2000 microchip technology inc. ds80024b-page 3 pic12c508a/509a 13.3 dc characteristics: pic12c508a/509a (commercial, industrial, extended) pic12ce518/519 (commercial, industrial, extended) pic12cr509a (commercial, industrial, extended) dc characteristics standard operating conditions (unless otherwise specified) operating temperature 0 c t a +70 c (commercial) ? 40 c t a +85 c (industrial) ? 40 c t a +125 c (extended) operating voltage v dd range as described in dc spec section 13.1 and section 13.2. param no. characteristic sym min typ? max units conditions input high voltage i/o ports v ih - d040 with ttl buffer 2.0v - v dd v4.5v v dd 5.5v d040a 0.25v dd + 0.8v -v dd votherwise d070 gpio weak pull-up current (note 4) i pur 30 250 400 av dd = 5v, v pin = v ss input leakage current (notes 2, 3) i il d061 gp3/mclr (note 5) 8 130 250 avss v pin v dd d061a gp3/mclr (note 6) - - + 5 avss v pin v dd ? data in ? typ ? column is at 5v, 25 c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: in extrc oscillator configuration, the osc1/clkin pin is a schmitt trigger input. it is not recommended that the pic12c5xx be driven with external clock in rc mode. 2: the leakage current on the mclr pin is strongly dependent on the applied voltage level. the specified levels represent nor- mal operating conditions. higher leakage current may be measured at different input voltages. 3: negative current is defined as coming out of the pin. 4: does not include gp3. for gp3 see parameters d0061 and d0061a. 5: this spec. applies to gp3/mclr configured as external mclr and gp3/mclr configured as input with internal pull-up enabled. 6: this spec. applies when gp3/mclr is configured as an input with pull-up disabled. the leakage current of the mclr circuit is higher than the standard i/o logic.
pic12c508a/509a ds80024b-page 4 ? 2000 microchip technology inc. 13.4 dc characteristics: pic12lc508a/509a (commercial, industrial) pic12lce518/519 (commercial, industrial) pic12lcr509a (commercial, industrial) dc characteristics standard operating conditions (unless otherwise specified) operating temperature 0 c t a +70 c (commercial) ? 40 c t a +85 c (industrial) operating voltage v dd range as described in dc spec section 13.1 and section 13.2. param no. characteristic sym min typ ? max units conditions input high voltage i/o ports v ih - d040 with ttl buffer 2.0v - v dd v4.5v v dd 5.5v d040a 0.25v dd + 0.8v -v dd v otherwise d070 gpio weak pull-up current (note 4) i pur 30 250 400 av dd = 5v, v pin = v ss input leakage current (notes 2, 3) i il d061 gp3/mclr (note 5) 8 130 250 a vss v pin v dd d061a gp3/mclr (note 6) - - + 5 a vss v pin v dd ? data in ? typ ? column is at 5v, 25 c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: in extrc oscillator configuration, the osc1/clkin pin is a schmitt trigger input. it is not recommended that the pic12c5xx be driven with external clock in rc mode. 2: the leakage current on the mclr pin is strongly dependent on the applied voltage level. the specified levels represent nor- mal operating conditions. higher leakage current may be measured at different input voltages. 3: negative current is defined as coming out of the pin. 4: does not include gp3. for gp3 see parameters d0061 and d0061a. 5: this spec. applies to gp3/mclr configured as external mclr and gp3/mclr configured as input with internal pull-up enabled. 6: this spec. applies when gp3/mclr is configured as an input with pull-up disabled. the leakage current of the mclr circuit is higher than the standard i/o logic.
? 2000 microchip technology inc. ds80024b-page 5 pic12c508a/509a table 13-1: pull-up resistor ranges* - pic12c508a, pic12c509a, pic12cr509a, pic12ce518, pic12ce519, pic12lc508a, pic12lc509a, pic12lcr509a, pic12lce518 and pic12lce519 reset when mclr is asserted, the state of the osc1/clkin and clkout/osc2 pins are as follows: v dd (volts) temperature ( c) min typ max units gp0/gp1 2.5 ? 40 38k 42k 63k ? 25 42k 48k 63k ? 85 42k 49k 63k ? 125 50k 55k 63k ? 5.5 ? 40 15k 17k 20k ? 25 18k 20k 23k ? 85 19k 22k 25k ? 125 22k 24k 28k ? gp3 (1) 2.5 ? 40 65k 80k 850k ? 25 80k 100k 1150k ? 85 85k 110k 1300k ? 125 100k 120k 1500k ? 5.5 ? 40 50k 60k 600k ? 25 60k 65k 750k ? 85 65k 80k 900k ? 125 75k 90k 990k ? * these parameters are characterized but not tested. note 1: the weak pull-up resistor and associated current for the gp3/mclr pin is non-linear when the respective pin voltage is less than v dd - 1.0v. see parameter d061 for gp3/mclr pin current specifications. clkin/clkout pin states when mclr asserted oscillator mode osc1/clkin pin osc2/clkout pin extrc, clkout on osc2 osc1 pin is tristated and driven by external circuit osc2 pin is driven low extrc, osc2 is i/o osc1 pin is tristated and driven by external circuit osc2 pin is tristate input intrc, clkout on osc2 osc1 pin is tristate input osc2 pin is driven low intrc, osc2 is i/o osc1 pin is tristate input osc2 pin is tristate input
information contained in this publication regarding device applications and the like is intended through suggestion only and ma y be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is give n and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip ? s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under an y intellectual property rights. the microchip logo and name are registered trademarks of microchip technology inc. in the u.s.a. and other countries. a ll rights reserved. all other trademarks mentioned herein are the property of their respective companies. ds80024b-page 6 ? 2000 microchip technology inc. all rights reserved. ? 2000 microchip technology incorporated. printed in the usa. 6/00 printed on recycled paper. americas corporate office microchip technology inc. 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-786-7200 fax: 480-786-7277 technical support: 480-786-7627 web address: http://www.microchip.com atlanta microchip technology inc. 500 sugar mill road, suite 200b atlanta, ga 30350 tel: 770-640-0034 fax: 770-640-0307 boston microchip technology inc. 2 lan drive, suite 120 westford, ma 01886 tel: 508-480-9990 fax: 508-480-8575 chicago microchip technology inc. 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas microchip technology inc. 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 dayton microchip technology inc. two prestige place, suite 150 miamisburg, oh 45342 tel: 937-291-1654 fax: 937-291-9175 detroit microchip technology inc. tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 los angeles microchip technology inc. 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 new york microchip technology inc. 150 motor parkway, suite 202 hauppauge, ny 11788 tel: 631-273-5305 fax: 631-273-5335 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 americas (continued) toronto microchip technology inc. 5925 airport road, suite 200 mississauga, ontario l4v 1w1, canada tel: 905-405-6279 fax: 905-405-6253 asia/pacific china - beijing microchip technology, beijing unit 915, 6 chaoyangmen bei dajie dong erhuan road, dongcheng district new china hong kong manhattan building beijing, 100027, p.r.c. tel: 86-10-85282100 fax: 86-10-85282104 china - shanghai microchip technology unit b701, far east international plaza, no. 317, xianxia road shanghai, 200051, p.r.c. tel: 86-21-6275-5700 fax: 86-21-6275-5060 hong kong microchip asia pacific unit 2101, tower 2 metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2-401-1200 fax: 852-2-401-3431 india microchip technology inc. india liaison office no. 6, legacy, convent road bangalore, 560 025, india tel: 91-80-229-0061 fax: 91-80-229-0062 japan microchip technology intl. inc. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea tel: 82-2-554-7200 fax: 82-2-558-5934 asia/pacific (continued) singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-334-8870 fax: 65-334-8850 taiwan microchip technology taiwan 10f-1c 207 tung hua north road taipei, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe denmark microchip technology denmark aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france arizona microchip technology sarl parc d ? activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany arizona microchip technology gmbh gustav-heinemann-ring 125 d-81739 m nchen, germany tel: 49-89-627-144 0 fax: 49-89-627-144-44 italy arizona microchip technology srl centro direzionale colleoni palazzo taurus 1 v. le colleoni 1 20041 agrate brianza milan, italy tel: 39-039-65791-1 fax: 39-039-6899883 united kingdom arizona microchip technology ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5858 fax: 44-118 921-5835 05/16/00 w orldwide s ales and s ervice microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms and microperipheral products. in addition, microchip ? s quality system for the design and manufacture of development systems is iso 9001 certified.


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